test project

 temperature cycle test

       reference standard

      GB/T 2423.3-2016; IEC 60068-2-78: 2012

       capabilities

 Temperature range: -70℃~180℃
 Humidity range: 20%RH~98%RH;1m×1m×1m

Temperature cycling test is a test that simulates the impact of alternating temperature environments on the mechanical and electrical properties of electronic components. There is no essential difference between the temperature shock test and the temperature cycle test, only the difference in severity.
In actual use of electronic products, such environmental conditions with sharp temperature changes may be encountered. For example, in severe winter, when electronic products are moved from indoor to outdoor work, or from outdoor to indoor work, they will encounter large changes in temperature; another example is that an aircraft takes off from an airport, quickly climbs high altitude, or dives down from a high altitude. When airborne electronic equipment will encounter a large temperature change environment. Therefore, electronic components are required to have the ability to withstand such rapid temperature changes.
The severity level of the temperature cycle test is determined by the high and low temperature temperature values, balance time, conversion time and number of cycles constituting the cycle. It mainly controls the temperature, time and speed of transition between high and low temperatures when the product is at high and low temperatures. The flow of gas in the test chamber, the position of the temperature sensor, and the heat capacity of the fixture are all important factors to ensure the test conditions.
test purposes
The purpose of temperature cycle testing is to assess the ability of electronic components to withstand repeated temperature changes in a short period of time and the thermal matching performance between different structural materials.
Test principle:
In the temperature cycle test, electronic components repeatedly endure temperature changes in a short period of time. As a result, electronic components repeatedly endure thermal expansion and contraction changes, resulting in alternating stress caused by thermal expansion and contraction, which will cause harmful effects such as material cracking, poor contact, and performance changes.

In the field of semiconductor device testing, temperature cycling experiments can be used to test the thermal sensitivity of chips. Since electronic components are easily damaged at high temperatures, temperature cycling experiments can simulate the high temperature environment of the chip during use and test whether it can operate normally. In addition, temperature cycling experiments can also be used to test the fatigue properties of various materials, such as the fatigue life of metals, plastics and other materials.